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Effect Of Aging On The Transformation Of Phases In Solder Joint Of PBGA Packaging
(Materials Science & Engineering, 2010-07-19)
This study investigates the microstructural characteristics of 3.0Ag-0.5Cu-Sn (SAC305) solder joint as in assembled state, and their evolution with aging treatment at 100 and 150°C for various hours. Specific aim of the ...