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A COMPARATIVE STUDY OF THE THERMO-MECHANICAL BEHAVIOR OF WCSP ASSEMBLY DUE TO DIFFERENCE IN PCBS’ LAYER THICKNESS
(2016-05-10)
The reliability of Chip Scale Package assembly is of great concern for the electronic industry. Due to multiple function integration of the present devices there is a high demand of ultra-miniaturization of the integrated ...
A STUDY OF ELECTRICAL DOUBLE LAYER AT AN ALUMINUM SURFACE IN AN AUTOMOTIVE COOLING SYSTEM
(2016-05-10)
Electrolytic corrosion is identified as a major problem which adversely affects the performance of a cooling system and hence compromises the performance of automobile with it. Electrolysis corrosion is a chemical reaction ...
CFD MODELLING OF WET COOLING MEDIA AND DESIGN OPTIMIZATION OF HEAT SINK FOR DATA CENTER APPLICATION
(2016-05-12)
Air cooling is most widely used and economical method of currently available cooling technologies in which heat exchanger plays a vital role in facility designs. Evaporative cooling can be energy efficient than mechanical ...
CFD Analysis and Design Optimization of Heat Sink for Oil Immersion Cooling
(2016-05-11)
Air cooling is predominant cooling technique employed in most of the data centers. As the demand for High performance computing (HPC) which deploy large concentration of high-end servers (30 kW to 200 kW per rack) is ...
Exergy Analysis of a Pulse Detonation Engine Linear Power Generator
(2016-05-11)
The fuel efficiency of a power generator is a key metric for evaluating its performance. The common engineering practice is to determine the thermal efficiency of the system by applying the conservation of energy also known ...
MEASUREMENT AND OPTIMIZATION OF THERMAL TRANSPORT PHENOMENA FOR WELD STRENGTH IMPROVEMENT IN POLYMER EXTRUSION BASED ADDITIVE MANUFACTURING
(2020-05-06)
Additive manufacturing (AM) processes involve layer-by-layer addition of material to fabricate a 3-dimensional part. AM offers significant design and manufacturing flexibility compared to traditional manufacturing approaches. ...
THERMAL DESIGN ANALYSIS OF SERVER CHASSIS MANIFOLDS FOR LIQUID COOLED SERVERS USING CFD
(2021-05-18)
Direct-to-chip liquid cooling is one of the most popular methods in data center thermal management when it comes to cooling high chip power densities. A cold plate-based liquid cooling system contains various components ...
DESIGN AND OPTIMIZATION OF THERMAL MANAGEMENT APPROACHES IN DATA CENTER APPLICATIONS
(2020-01-14)
In the present day to day life, Internet of Things (IOT) is everything, i.e., Internet and telecommunication is needed for almost every task of our life, which require data centers. These data centers provide various ...
DROPLET-BASED MICROEXTRACTION OF DNA ENABLED BY ELECTROWETTING-ON-DIELECTRIC DIGITAL MICROFLUIDICS
(2020-01-06)
In recent years there have been significant advances in micro/nanotechnologies employing miniaturized platforms to achieve efficient sample pre-processing, separation, and quantification processes. The idea of bringing ...
Characterization of Fatigue Strength of Additively Manufactured Ti-6Al-4V with Recoater Blade Interference Flaws and Residual Stresses Towards an Enhanced Fatigue Substantiation Methodology for Aerospace Structures Applications
(2022-08-17)
This research characterized the fatigue strength of additively manufactured (AM) Ti-6Al-4V, through fatigue and static tests conducted using specimens with and without recoater blade interference flaws (RBIF), and thus ...