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Development Of An Experimental And Analytical Model Of An Active Cooling Method For High-power Three-dimensional Integrated Circuit (3D-IC) Utilizing A Multidimensional Configured Thermoelectric Modules
(Mechanical Engineering, 2011-07-14)
An increase in demand for more functionality and capacity of microelectronic components within the same logistic footprint drives the growth of three-dimensional integrated circuit (3D-IC) packaging technologies in recent ...