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SOLDER JOINT DESIGN OPTIMIZATION OF QUAD-FLAT PACKAGE WITH GULLWING LEADS UNDER ACCELERATED THERMAL CYCLING AND POWER CYCLING
(2018-07-10)
Ever growing complexity in designing of Integrated Circuits and accommodating high number of Interconnections in the device is the main source of motivation in today’s world of IC devices. Quad Flat Package (QFP) with ...
EFFECT OF SOLDER VOIDS AND DISTANCE TO NEUTRAL POINT (DNP) ON SJR OF WCSP UNDER REFLOW CONDITION AND THERMAL CYCLING
(2017-12-08)
Since the introduction of Chip Scale Packages (CSP’s) in the early 2000s, they have become one of the biggest packaging trends in recent history. There are currently over 50 different types of CSP’s available throughout ...
RELIABILITY ASSESSMENT OF SOLDER JOINT USING BGA PACKAGE – MEGTRON 6 VERSUS FR4 PRINTED CIRCUIT BOARDS
(2017-05-24)
When it comes to the mechanical and electrical seam of the Printed Circuit Board (PCB) and package, reliability of the board plays a major impact on PCB. As the frequency increases, losses in signals increase. This ...
BOARD LEVEL FLEXURAL RELIABILITY TESTING AND FAILURE ANALYSIS OF PRINTED CIRCUIT BOARDS WITH WCSP PACKAGES
(2015-12-09)
Printed circuit boards, widely known as PCBs; are the skeleton behind every technology today. Electronics have integrated with every other engineering domain to improve the outcomes. It is very important that they remain ...
Solder Ball Reliability Assessment of Wafer Level Chip Scale Package (WLCSP) Through Power Cycling
(2016-12-20)
Failure analysis and its effects are major reliability concerns in electronic packaging. More accurate fatigue life prediction can be obtained after the consideration of all affecting loads on the electronic devices. When ...
Characterization of Fatigue Strength of Additively Manufactured Ti-6Al-4V with Recoater Blade Interference Flaws and Residual Stresses Towards an Enhanced Fatigue Substantiation Methodology for Aerospace Structures Applications
(2022-08-17)
This research characterized the fatigue strength of additively manufactured (AM) Ti-6Al-4V, through fatigue and static tests conducted using specimens with and without recoater blade interference flaws (RBIF), and thus ...
COMPUTATIONAL RELIABILITY ANALYSIS OF BLIND MICRO-VIA WITH 3D AND AXISYMMETRIC MULTI-LAYER PCB
(2022-05-18)
Micro-via are components that are used to form connections from one layer to another in most Multilayered Printed Circuit Boards (PCBs). The failure of Micro-via has always been a concern of the electronic industry. The ...
Impact of Immersion Cooling on Thermo-Mechanical Properties of PCB's and Reliability of Electronic Packages
(2019-05-17)
Immersion cooling technique is used for the thermal management of high-density data centers to avoid overheating of components and failure of servers. However, to use this as a viable cooling technique, the effect of ...
CHARACTERIZING CONTAMINATION TO EXPAND ASHRAE ENVELOPE IN AIRSIDE ECONOMIZATION AND THERMAL AND RELIABILITY IN IMMERSION COOLING OF DATA CENTERS
(2018-08-24)
The Datacom facility which comprises rooms or closets used for communication, computers/servers or electronic equipment requires cooling unit which consumes 31% (23% HVAC cooling + 8% HVAC fans) of overall energy. The ...
IMPACT OF MATERIAL MODELS ON IMMERSION COOLED ELECTRONICS PACKAGES AND RELIABILITY ASSESSMENT FOR CHIP-PACKAGE INTERACTION
(2021-05-13)
The immersion cooling for IT equipment has been around for decades. From thermal energy management perspective, immersion cooling is better than traditional cooling technology. However, there is need for more work in open ...