Search
Now showing items 1-1 of 1
STRUCTURAL OPTIMIZATION AND RELIABILITY ASSESSMENT OF HETEROGENEOUS 3D IC PACKAGES AND ANALYSIS OF RHEOLOGICAL PROPERTIES OF PARTICLE BASED THERMAL INTERFACE MATERIALS
(2021-04-28)
As computing and communication devices are converging with improved functionally, denser, and finer pitch which creates complexity of circuit interconnections for 2-D devices becomes a limitation for overall performance ...