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dc.contributor.advisor | Agonafer, Dereje | |
dc.creator | Pittala, Deekshith | |
dc.date.accessioned | 2016-01-27T21:17:08Z | |
dc.date.available | 2016-01-27T21:17:08Z | |
dc.date.created | 2015-12 | |
dc.date.issued | 2015-12-08 | |
dc.date.submitted | December 2015 | |
dc.identifier.uri | http://hdl.handle.net/10106/25487 | |
dc.description.abstract | 3D die stacking is an exciting new technology that increases the transistor’s density by integrating two or more dies vertically with a dense high – speed interface. The result of 3D die stacking is a significant reduction of interconnect both within a die and across dies in a system. The objective of the thermal design requirement for a 3D stacked die package is to maintain the junction temperatures of the devices at or below specified limits. Installing the Heat sink aid the heat transfer activity from a package. The extent of cooling and the junction temperatures vary if the designs of the heat sinks change. Therefore, this study is to discover a heat sink which gives the best result in the heat extraction process. | |
dc.format.mimetype | application/pdf | |
dc.language.iso | en_US | |
dc.subject | Electronic packaging | |
dc.subject | 3D die stacking | |
dc.subject | Heat sink | |
dc.title | Computational Analysis of Enhancing Heat Transfer in a 3-D stacked Die Using Different Finned Heat Sink | |
dc.type | Thesis | |
dc.date.updated | 2016-01-27T21:17:08Z | |
thesis.degree.department | Mechanical and Aerospace Engineering | |
thesis.degree.grantor | The University of Texas at Arlington | |
thesis.degree.level | Masters | |
thesis.degree.name | Master of Science in Mechanical Engineering | |
dc.type.material | text | |
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