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Now showing items 31-37 of 37
Thermo-mechanical Analysis Of A 3D Package In Microelectronics And Cooling Technologies For An IGBT Thermal Tester In Power Electronics
(Mechanical Engineering, 2010-07-19)
In the past, compact components such as chip scale packages and flip chip packages were the work horses of miniaturization. However emerging applications are now demanding even higher packaging density which has led to the ...
Effects Of Freezing On The Mechanical Properties Of Engineered Tissues
(Mechanical Engineering, 2010-07-19)
Cryopreservation is used to preserve cells and tissues at low temperatures for short and long term uses. Some examples of where cryopreservation is used include the storage of organs, blood, embryos, and artificial tissues. ...
Kinematic Analysis Of A Quadruped Robot Capable Of Working As A Machining Tool
(Mechanical Engineering, 2010-11-01)
Parallel robots have been proposed for some time now due to their potential advantages over serial robots in high load bearing, acceleration, stiffness and with lower moving mass. Mobile parallel configurations, i.e. ...
Analysis Of Thrust Development In A Pulse Detonaton Engine
(Aerospace Engineering, 2010-07-19)
Pulse detonation engines (PDE) employ detonation waves to compress and burn the fuel and oxidizer mixture which results in the release of high pressure and temperature. The objective of the present study is to analytically ...
Peak Stress Of Composite Multiple-hole Laminates With And Without Patch
(Aerospace Engineering, 2010-07-19)
In repairing of composite structures, the damage in the composite laminate is usually removed in the form of circular cutouts which results in holes in the laminate. Then a patch laminate is adhesively bonded to the damaged ...
Richtmyer-Meshkov Instability In Reactive Mixtures.
(Aerospace Engineering, 2010-07-19)
This research analyzes the effect of reactivity on the Richtmyer-Meshkov instability with particular emphasis on the velocity and wave number scaling and on the effect of free detonation instability modes on the interface ...
Electrowetting On Dielectric (EWOD) Digital Microfluidics For Electronic Hotspot Cooling
(Mechanical Engineering, 2010-03-03)
Electronics cooling was a field dominated by bulky and heavy heat sinks, heat pipes and fans for decades. Lately, the size of the electronic components has decreased to a substantial extent with an increase in performance. ...