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THE RELATIONSHIP OF LIFE PREDICTION FOR QUAD FLAT N0-LEAD PACKAGE (QFN )PACKAGES USING 4 POINT BEND TEST AND THERMAL CYCLE TESTING
(2016-01-05)
In the structural design of the Printed Circuit Boards, the stiffness modulus of the involved Fr4 and Cu layers play an important role. The 4 point bend test is one of the few test methods which is included in the JEDEC ...