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PARAMETRIC STUDY OF AN IGBT COLD PLATE AND AFFECT OF DEVICE LEVEL MODELLING ON SYSTEM LEVEL THERMAL PREDICTIONS
(2016-02-29)
In power electronics, as there is continuous increase in performance of the electronic devices, simultaneously the size of the components used in these devices keep on decreasing. This has resulted in increased power ...
CONTROL STRATEGIES FOR AIR-SIDE ECONOMIZATION, DIRECT AND INDIRECT EVAPORATIVE COOLING AND ARTIFICIAL NEURAL NETWORKS APPLICATIONS FOR ENERGY EFFICIENT DATA CENTERS
(2016-05-12)
The skyrocketing growth in data centers, facilities that house information technology (IT) equipment for storage, management and distribution of data while striving for 24/7/365 operation with 100% up-time, has accounted ...
Numerical Study on Morphology and Solidification Characteristics of Successive Droplet Depositions on a Substrate
(2016-05-10)
Successive droplet impingement finds extensive applications in additive manufacturing technologies such as 3D printing, Liquid Metal Jetting and Net Form Manufacturing. Deposition, deformation and solidification of droplets ...
Design of flow control device for dynamic cold plate and optimization of servers to decrease junction temperature of heat sinks
(2016-12-19)
Electronics cooling research is facing the challenges of high heat flux removal and increased pumping power. Not much attention has been focused related to server and module level cooling. The continued increase in heat ...
COMPUTATIONAL ANALYSIS OF BLAST INDUCED DAMAGE ON NEURONS IN BRAIN DURING TRAUMATIC BRAIN INJURY
(2016-05-10)
Concussions are the most common kind of brain injuries, they are also called as mild Traumatic Brain Injuries (mTBI). In recent times, mTBIs are perceived as one of the major health problems faced by millions across the ...
DESIGN AND STIFFNESS OPTIMIZATION OF QUADRI-DIRECTIONAL COMPOSITE GRID LATTICE STRUCTURES
(2016-05-11)
Composite grid structures are rib stiffeners connected to each other rigidly in a pattern or a lattice such that the whole grid pattern has certain smeared stiffness property and has a certain structural behavior. The main ...
Computational Analysis of Impact Loading on Wafer Level Chip Scale Packages Mounted on Printed Circuit Boards of Varying Thickness
(2016-05-10)
In the electronic industry one of the popular package is Chip Scale Package (CSP) due to its small form factor and low cost. To meet the need of new functionality and portability of the recent devices, CSPs’ have been most ...
E-LEARNING MODULES FOR NUCLEAR REACTOR HEAT TRANSFER
(2016-05-13)
E learning in engineering education is becoming popular at several universities as it allows instructors to create content that the students may view and interact with at his/her own convenience. Web-based simulation and ...
OPTIMIZATION OF AIR COOLED PORTION IN A SERVER WITH WATER COOLED MICRO-PROCESSORS
(2016-05-10)
A Data center is the heart of our associated world. It is a facility that houses computer systems and related components. According to IDC, because of enormous increment in pattern of IoT (Internet of Things) and distributed ...
EXPERIMENTAL CHARACTERIZATION OF HYBRID COOLED CISCO SERVERS INCLUDING THE EFFECT OF WARM WATER COOLING
(2016-05-10)
The information technology (IT) owners are experiencing a greater cooling challenge because of the increase in power density due to modern computational needs. The non-uniform power density in each server is forcing the ...