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Thermal Stresses Of Composite Beams With Rectangular And Tubular Cross-sections
(Mechanical Engineering, 2008-04-22)
Closed-form analytical solutions for laminated composite beams with tubular and rectangular cross-sections are developed for evaluating the thermal induced stresses. The derivations are based on modified lamination theory ...
Numerical Simulation Of Magnetohydrodynamics
(Aerospace Engineering, 2008-04-22)
Use of electromagnetic fields has been shown to be an effective way to control the behavior of electrically conducting fluids. Specifically, the modification of the boundary layer profile with electromagnetic fields can ...
Derivation Of The Dynamics Equations For Receiver Aircraft In Aerial Refueling
(Aerospace Engineering, 2008-04-22)
This thesis describes the derivation of a new set of nonlinear, 6--DOF equations of motion of a receiver aircraft undergoing an aerial refueling, including the effect of time-varying mass and inertia properties associated ...
The Lattice Boltzmann Method For Computational Fluid Dynamics Applications
(Aerospace Engineering, 2008-09-17)
An analysis of lattice Boltzmann method is presented in this thesis. This analysis contrast with the traditional lattice Boltzmann work, where complex fluids are considered with extended properties. Focus of the current ...
An Analytical And Numerical Model For Design Of Non- Uniformly Powered Silicon Chips Based On Both Thermal And Device Clock Performance
(Mechanical Engineering, 2008-04-22)
Silicon chips continue to grow in capabilities, complexity and performance. Silicon chips typically integrate functional components such as logic and level two (L2) cache memory in their architecture. This functional ...
On The Near Field Mean Flow Structure Of Transverse Jets Issuing Into A Supersonic Freestream
(Aerospace Engineering, 2008-04-22)
The near field mean flow structure of transverse jets issuing from a surface into
supersonic crossflow is examined using numerical methods and separation topology. The
Navier-Stokes solver Falcon, developed at Lockheed ...
Flip Chip Back End Design Parameters To Reduce Bump Electromigration
(Mechanical Engineering, 2008-09-17)
The advancement in flip chip technology has enabled us to meet the requirement of smaller die size along with the increased functionality. Due to this development in flip chip packaging technology along with higher current ...
Thermal Enhancement Of Stacked Dice Replacing Wire Bonds With Through Silicon Vias At Location Of Die Pads
(Mechanical Engineering, 2008-04-22)
Through Silicon vias can offer quick time to market of circuits designed in a modular manner and can also be used to customize the product according to the needs of the customers. This gives a way to avoid both excess ...
Structural Optimization Using MATLAB Partial Differential Equation Toolbox And Radial Basis Function Based Response Surface Model
(Mechanical Engineering, 2008-09-17)
As a decision making tool, optimization has become an inseparable part of the modern design process. However, in spite of the advances in computer capacity and speed, the computational time for some complex problems is too ...
Analytical Thermal Model Of A Generic Multi-layer Spacerless 3D Package
(Mechanical Engineering, 2008-09-17)
Analytical Thermal Model of a Generic Multi-Layer Spacerless 3D Package Abstract The need for more functions in a single device has lead to die stacking architecture. Although the number of functional die increases further ...