Search
Now showing items 51-60 of 916
Semi-analytical Complex Variable Based Stochastic Finite Element Method
(Mechanical Engineering, 2009-09-16)
The stochastic finite element method (SFEM) is an approach that allows an analyst to define material, load, and geometry parameters as random variables to represent uncertainty in an engineering problem. The method is then ...
Effect Of Structural Design Parameters On Wafer Level CSP Ball Shear Strength And Their Influence On Accelerated Thermal Cycling Reliability
(Mechanical Engineering, 2010-07-19)
Wafer level chip scale package (WLCSP) is one of the most popular packages due to its size and cost advantages. It is expected that the usage of WLCSP in microelectronics and MEMS industry combined is going to cross 16000 ...
Flip Chip Back End Design Parameters To Reduce Bump Electromigration
(Mechanical Engineering, 2008-09-17)
The advancement in flip chip technology has enabled us to meet the requirement of smaller die size along with the increased functionality. Due to this development in flip chip packaging technology along with higher current ...
Characterization And Cooling Capacity Enhancement Of A Porous Ceramic Wick Based Coldplate
(Mechanical Engineering, 2009-09-16)
Current passive cooling methods of aerospace and military, high heat-flux electronics include the use of thermal planes made of exotic metal alloys, which have been designed, at a great expense, to have high thermal ...
Analysis Of Data Center Cooling Strategies And The Impact Of The Dynamic Thermal Management On The Data Center Efficiency
(Mechanical Engineering, 2010-03-03)
The power trend for Server systems continues to grow thereby making thermal management of Data centers a very challenging task. Although various configurations exist, the raised floor plenum with Computer Room Air Conditioners ...
Experimental Investigation Of Flow Boiling And Spray Cooling On Enhanced Surfaces In FC-72
(Mechanical Engineering, 2009-09-16)
In this study the effect of a recently developed, thermally conductive microporous coating on flow boiling and spray cooling performance was studied using FC-72 as the working fluid. The overall goal is to further increase ...
Flexible Microfluidic Circuit With Embedded In-plane Valve
(Mechanical Engineering, 2007-09-17)
Recent developments in Microfluidic systems have demonstrated many potential applications related to biology, chemistry and medical sciences. Fluidic manipulation with precise volume control is a basic function in these ...
Thermal Enhancement Of Stacked Dice Replacing Wire Bonds With Through Silicon Vias At Location Of Die Pads
(Mechanical Engineering, 2008-04-22)
Through Silicon vias can offer quick time to market of circuits designed in a modular manner and can also be used to customize the product according to the needs of the customers. This gives a way to avoid both excess ...
Applications Of Sensitivity Data To Eigensolution Reanalysis Of Modified Structures
(Mechanical Engineering, 2010-11-01)
Methods of computing eigensolution sensitivity have been known for a long time. Both exact and approximate methods are available in the literature. While eigenvalue sensitivity is used routinely in structural optimization ...
Solution To Multi Term Boltzmann Equation For Plasma Assisted Combustion
(Aerospace Engineering, 2010-11-01)
Plasma assisted ignition and combustion (PAIC) is a technology where plasma is generated by high voltage, nano second pulse duration and high repetitive rate pulses. The high reduced electric field during the pulse allows ...