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3-D Fracture Study Of The BEoL Cu/Low-k Stack To Assess And Mitigate The CPI Risk During The Reflow Process
(Mechanical Engineering, 2014-03-12)
As scaling of components continues, using SiO2 as a dielectric in the Back-End-Of-Line (BEoL) is no longer a viable option and can be replaced with low-k and ultralow-k (ULK) dielectric materials for advanced integrated ...