Browsing Department of Mechanical and Aerospace Engineering by Author "Agonafer, Dereje"
Now showing items 1-20 of 216
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3-D Fracture Study Of The BEoL Cu/Low-k Stack To Assess And Mitigate The CPI Risk During The Reflow Process
Baig, Zaeem (Mechanical Engineering, 2014-03-12)As scaling of components continues, using SiO2 as a dielectric in the Back-End-Of-Line (BEoL) is no longer a viable option and can be replaced with low-k and ultralow-k (ULK) dielectric materials for advanced integrated ... -
A COMPARATIVE STUDY OF THE THERMO-MECHANICAL BEHAVIOR OF WCSP ASSEMBLY DUE TO DIFFERENCE IN PCBS’ LAYER THICKNESS
Barua, Trina; 0000-0002-6483-8553 (2016-05-10)The reliability of Chip Scale Package assembly is of great concern for the electronic industry. Due to multiple function integration of the present devices there is a high demand of ultra-miniaturization of the integrated ... -
A METHODOLOGY TO DEVELOP A CONTROL SYSTEM APP FOR DATA CENTER COOLING
Rahul, Varun (2016-12-19)DCIM (Data Center Infrastructure Management), are tools that are available in the industry to serve the purpose of controlling different parameters in the data center. But their cost is significantly high. The idea of ... -
A PARAMETRIC STUDY ON THERMAL MIXING OF AMBIENT AIR AND RETURN AIR STREAMS IN A MIXING CHAMBER OF A DATA CENTER COOLING
Kaulgud, Pavan Vijaykumar (2017-05-18)Thermal Mixing of ambient air and return air streams in a mixing chamber for data center cooling Keywords: Data center cooling, Air side economization, Mixing chamber geometry Pavan Kaulgud, Dr. Dereje Agonafer Air ... -
A Study on Evaporative Cooling for data centers & Artificial Neural Network Modeling
Karmokar, Pritam (2015-12-07)This study mainly aims at exploring how, one of the best “Green” solutions for IT equipment cooling aka Evaporative Cooling, can be optimized for better future deployment. Also, this study focuses on ways to deploy Artificial ... -
Accelerated Performance Degradation of Single-Phase Cold Plates for Direct-to-chip Liquid Cooled Data Centers
Chinthaparthy, Lochan Sai Reddy; 0000-0003-1128-7281 (2021-12-21)Expanding demands for cloud-based computing and storage, the Internet of Things, and AI-based applications have escalated thermal loads in high-density data centers which necessitated the utilization of more efficient ... -
Accelerated Thermal Cycling of Printed Circuit Board for Single Phase Immersion Cooling systems
Duraisamy Asokan, Surya; 0000-0002-5410-1734 (2018-05-24)The adoption of immersion cooling of data center over conventional air-cooling is one among the more up to date advances that individuals have begun embracing to. Acknowledgement of Single phase Liquid Immersion cooling ... -
Air Flow Pattern and Path Flow Simulation of Airborne Particulate Contaminants in a Cold-Aisle Containment High-Density Data Center Utilizing Airside Economization
Thirunavakkarasu, Gautham; 0000-0003-3523-9284 (2018-05-17)The energy used by Information Technology Equipment (ITE) and the supporting data center equipment keeps rising as data center expansion continues worldwide. To contain the rising operation costs, data center administrators ... -
Airflow Path and Flow Pattern Analysis of Sub-Micron Particulate Contaminants in a Data Center with Hot Aisle Containment System Utilizing Direct Air Cooling
Saini, Satyam (2018-05-22)The percentage of the energy used by data centers for cooling their equipment has been on the rise. With it has been the necessity for exploring new and more efficient methods, both from an engineering as well as business ... -
Alternative Cooling Technologies For Telecommunication Data Centers: Air Cooling And Rear Door Heat Exchangers
Mynampati, Venkata Naga Poornima (Mechanical Engineering, 2011-03-03)Telecommunication industry is currently emphasizing to a miniaturization and convergence. The need for smaller, smarter and faster devices is leading drastic increment in power density and accordingly, thermal management ... -
An Open Source APP-HARDWARE setup to control the system for DATA CENTER COOLING
Darekar, Anay Satish (2016-12-20)Control systems for data center cooling exists in the proprietary form and are often sold as part of the overall unit. They provide vital information related to the cooling systems and supply information on the temperature ... -
Analysis Of Data Center Cooling Strategies And The Impact Of The Dynamic Thermal Management On The Data Center Efficiency
Mulay, Veerendra Prakash (Mechanical Engineering, 2010-03-03)The power trend for Server systems continues to grow thereby making thermal management of Data centers a very challenging task. Although various configurations exist, the raised floor plenum with Computer Room Air Conditioners ... -
ANALYSIS OF GLASS TRANSITION TEMPERATURE OF PCB & SUBSTRATE USING DYNAMIC MECHANICAL ANALYSIS & THERMOMECHANICAL ANALYSIS
Yadav, Shristi (2020-12-22)Electronic Packaging materials and their properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Glass transition ... -
An Analytical And Numerical Model For Design Of Non- Uniformly Powered Silicon Chips Based On Both Thermal And Device Clock Performance
Kaisare, Abhijit D. (Mechanical Engineering, 2008-04-22)Silicon chips continue to grow in capabilities, complexity and performance. Silicon chips typically integrate functional components such as logic and level two (L2) cache memory in their architecture. This functional ... -
Analytical Solutions Of Steady-state Heat Conduction In Multi-layer Stack Packaging
Ghalambor, Saeed (Mechanical Engineering, 2014-09-17)Analytical models that can be utilized in modeling the steady-state temperature solutions of planar and 3D packaged integrated circuits are discussed. This mathematically-driven model will include solutions for uniform and ... -
Analytical Thermal Model Of A Generic Multi-layer Spacerless 3D Package
Rodrigo, Erantha Nuwan (Mechanical Engineering, 2008-09-17)Analytical Thermal Model of a Generic Multi-Layer Spacerless 3D Package Abstract The need for more functions in a single device has lead to die stacking architecture. Although the number of functional die increases further ... -
ANALYZING THE THERMOMECHANICAL PERFORMANCE OF TG400G MATERIAL SUBSTRATE CORE UNDER IMMERSION COOLING
Tirupati Venkatachal, Venkateswar Vishnu; 0009-0000-2225-5459 (2023-08-15)The relentless surge in demand for seamless information exchange through consumer electronics, driven by the indispensable role of the Internet, has given rise to an unprecedented need for data centres. Yet, the energy ... -
APPLICATION OF ARTIFICIAL NEURAL NETWORK FOR EVAPORATIVE COOLING IN DATA CENTRES
Adejokun, Feyisola (2017-01-17)A data center is a facility that may be used to house telecommunication or storage devices. Because of the 24/7 required operation of a data center, large segments of a data center are geared towards evacuating heat generated ... -
Application Of Phase Change Material In Sustainable Cooling Of Data Centers
Dhiman, Nikhil (Mechanical Engineering, 2013-07-22)The ever increasing information technology heat load and data center cooling energy are the main reasons to investigate the performance of microencapsulated phase change slurry over other heat transfer fluids. In recent ... -
Assessment Of Contaminant Flowpaths In Airside Economization And Analysis Of Thermal Performance At Tank And Server Level For Single-phase Immersion Cooled Data Centers
Saini, Satyam (2022-05-03)The last two decades of 2000 have seen an explosion of utilization and reliance on digital technologies and platforms. During this time, electronic devices have undergone intense miniaturization and a corresponding rise ...