dc.contributor.author | Kwark, Sang Muk | en_US |
dc.date.accessioned | 2007-08-23T01:56:20Z | |
dc.date.available | 2007-08-23T01:56:20Z | |
dc.date.issued | 2007-08-23T01:56:20Z | |
dc.date.submitted | November 2005 | en_US |
dc.identifier.other | DISS-1156 | en_US |
dc.identifier.uri | http://hdl.handle.net/10106/235 | |
dc.description.abstract | The present study is an experimental research of a liquid-heat-spreader (LHS) with saturated water at ~2.29 psia. A LHS, indirect liquid cooling module, was successfully fabricated using thin copper blocks and copper tubes using solder. Three types of LHS, Flat-type, L-type, and T-type, were developed for different orientations and were compared with solid metal blocks such as aluminum and copper.
The Flat-type LHS, 100 (W) × 254 (L) × 3 (T) mm3, was designed for vertical orientation. It showed a remarkable thermal performance by dissipating heat flux of 119 W/cm2 with below 100℃ chip temperature at the typical condition. The L-type and T-type were developed for horizontal application and thermal performance of both LHS was promising. In addition, other parameters, gap size, boiler plate thickness, LHS size, long-term reliability, surfactant, and chip size, were also investigated. | en_US |
dc.description.sponsorship | You, Seung Mun | en_US |
dc.language.iso | EN | en_US |
dc.publisher | Mechanical Engineering | en_US |
dc.title | The Thermal Characteristics Of Liquid-heat-spreader | en_US |
dc.type | M.S.M.E. | en_US |
dc.contributor.committeeChair | You, Seung Mun | en_US |
dc.degree.department | Mechanical Engineering | en_US |
dc.degree.discipline | Mechanical Engineering | en_US |
dc.degree.grantor | University of Texas at Arlington | en_US |
dc.degree.level | masters | en_US |
dc.degree.name | M.S.M.E. | en_US |
dc.identifier.externalLink | https://www.uta.edu/ra/real/editprofile.php?onlyview=1&pid=262 | |
dc.identifier.externalLinkDescription | Link to Research Profiles | |