Browsing by Subject "2.5D"

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    • Reliability of a 2.5D TSV package 

      Gaikwad, Neha Vinayak (2018-08-13)
      In the recent years, the Through Silicon Vias (TSVs) are helping a huge variety of the 3D IC and the 2.5D IC packaging applications to try to fulfill their requirements of functionality and higher connectivity at the expense ...