Browsing by Author "Lakhkar, Nikhil R."
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Effect Of Structural Design Parameters On Wafer Level CSP Ball Shear Strength And Their Influence On Accelerated Thermal Cycling Reliability
Lakhkar, Nikhil R. (Mechanical Engineering, 2010-07-19)Wafer level chip scale package (WLCSP) is one of the most popular packages due to its size and cost advantages. It is expected that the usage of WLCSP in microelectronics and MEMS industry combined is going to cross 16000 ...